Machine and process for cutting openings in a substrate

Machine for cutting an opening, such as a window in a planar substrate, said machine having at least a cutting tool a transfer system holding said substrate and driving said substrate along a determined direction, and an aspiration box to maintain the substrate during the cutting operation, said cutting tool comprising a laser generating a laser beam that can be moved in two perpendicular directions and evacuation means to evacuate a cut part of said substrate, wherein said aspiration box is located on the same side of the substrate as said cutting tool and further comprises a bottom wall with aspiration openings against which said substrate is aspirated and a cutting opening through which said laser beam is directed onto the substrate.