Contacts for electrochemical processing
AssigneeApplied Materials, Inc.
InventorsPaul Butterfield, Liang-Yuh Chen, Yongqi Hu, Antoine Manens, Rashid Mavliev, Stan Tsai
Life of this patent
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Abstract
Systems and methods for electrochemically processing a substrate. A contact element defines a substrate contact surface positionable in contact a substrate during processing. In one embodiment, the contact element comprises a wire element. In another embodiment the contact element is a rotating member. In one embodiment, the contact element comprises a noble metal.
Claims20
A method for electrochemical processing a substrate comprising a conductive surface, the method comprising:
- providing a pad body having a conductive rotating contact element extending from a polishing surface of the pad body;
- placing the conductive surface of the substrate in contact with the polishing surface of pad and the conductive rotating contact element;
- delivering a current through the conductive rotating contact element to the conductive surface of the substrate;
- and
- causing relative motion between the substrate and the pad, whereby the conductive rotating contact element is adapted to rotate while in contact with the substrate.
A method for electrochemically processing a substrate having a conductive surface, the method comprising:
- providing a pad having a polishing surface and a conductive contact element disposed through the pad, wherein an upper end of the conductive contact element defines a substrate contact surface;
- placing the conductive surface of the substrate in contact with the polishing surface of pad and with the substrate contact surface of the conductive contact element in presence of electrolytic fluid;
- and
- providing a first electrical bias to the conductive surface via the conductive contact element.
A method for removing a conductive material from a substrate surface, comprising:
- providing a pad having a compressible polishing surface including a plurality of conductive elements disposed through a plurality of openings in the pad;
- biasing the conductive material via the polishing surface with a first electrical bias to;
- flowing an electrolyte onto the pad while rotating the pad relative to the substrate;
- and
- providing a counter-electrode having a second electrical bias in communication with the conductive material via the electrolyte.
Dependencies are inferred from the claim text.