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US 2006/0231409 A1Published application
Plating solution, conductive material, and surface treatment method of conductive material
AssigneeTDK Corporation
InventorsTakeshi Sakamoto, Hiroyasu Morikawa, Yasuyuki Yamamoto, Keiichi Fukuda
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Abstract
A plating solution including a copper salt, an organic phosphonic acid compound, and at least one compound or ions selected from an amine, α-amino acid, ammonium ions, carbonic acid ions, carboxylic acid ions, dicarboxylic acid ions, sulfuric acid ions, and thiosulfuric acid ions and a method of treating the surface of a conductive material using this plating solution.
Claims6
A plating solution including:
- a copper salt,
- an organic phosphonic acid compound, and
- at least one compound or ions selected from an amine, α-amino acid, ammonium ions, carbonic acid ions, carboxylic acid ions, dicarboxylic acid ions, sulfuric acid ions, and thiosulfuric acid ions.
Dependencies are inferred from the claim text.