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US 2006/0231408 A1Published application
Plating method and electronic device
AssigneeSeiko Epson Corporation
InventorsHidemichi Furihata, Satoshi Kimura
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Abstract
A plating method includes the steps of (a) forming a roughened area in a predetermined area of a substrate, (b) forming a surface-active agent layer above at least the roughened area, (c) forming, above the roughened area, a catalyst layer above the surface-active agent layer, and (d) precipitating a metal layer above the catalyst layer.
Claims9
A plating method comprising the steps of:
- (a) forming a roughened area in a predetermined area of a substrate;
- (b) forming a surface-active agent layer above at least the roughened area;
- (c) forming, above the roughened area, a catalyst layer above the surface-active agent layer;
- and
- (d) precipitating a metal layer above the catalyst layer.
2 more elements
Dependencies are inferred from the claim text.