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US 2006/0231287 A1Published application
Wiring structure and recording apparatus and electronic apparatus including wiring structure
AssigneeSeiko Epson Corporation
InventorTeruo Nakayama
Life of this patent
Estimating the term…
Abstract
A wiring structure includes a substrate, a first circuit and a second circuit, provided on the substrate, a first wire, provided on the substrate, and connecting the first circuit and the second circuit, the first wire having a first length, and a second wire, provided on the substrate, and connecting the first circuit and the second circuit, the second wire having the first length and including a first swirled part.
Claims6
A wiring structure comprising:
- a substrate;
- a first circuit and a second circuit, provided on the substrate;
- a first wire, provided on the substrate, and connecting the first circuit and the second circuit, the first wire having a first length;
- and
- a second wire, provided on the substrate, and connecting the first circuit and the second circuit, the second wire having the first length and including a first swirled part.
2 more elements
Dependencies are inferred from the claim text.