Integrated thermal exchange systems and methods of fabricating same
AssigneePAR Technologies, LLC
InventorJames Ball
Life of this patent
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AssigneePAR Technologies, LLC
InventorJames Ball
Estimating the term…
Thermal exchange systems integrate a thermal transfer unit (22); a fluid cooling assembly (24); a pump (26); and a fan (28). The thermal transfer unit (22) interfaces with a body to be thermally conditioned and transfers thermal energy to a fluid. The fluid cooling assembly (24) cools the fluid obtained from the thermal transfer unit. The fan (28) directs air around the fluid cooling assembly (24). The pump (26) circulates fluid in a circuit comprising the pump (26), the fluid cooling assembly (2), and the thermal transfer unit (22). In one aspect of integrated system technology, the fan (28) and the circuit are compactly arranged and substantially situated entirely within a footprint (33) of a module housing (30). As another technological aspect, the fluid cooling assembly (24) comprises plural thermal dissipation plates (45) which are laminated together. In an example, non-limiting mode, the plural thermal dissipation plates (45) have features formed thereon by etching or stamping. Such features which may be etched or stamped can include one or more of an aperture (53/64) for defining a fluid inlet channel; a fluid return aperture (55); a thermal dissipation fin (67); a fluid return region (65) which is substantially surrounded by a lamination contact surface through which the thermal dissipation plate (45) is in contact with an adjacent thermal dissipation plate.
An integrated thermal exchange module comprising:
A thermal exchange system comprising:
A thermal exchange system comprising:
A method of making a thermal exchange system, the method comprising:
A pump comprising:
Dependencies are inferred from the claim text.