Support board separating apparatus, and support board separating method using the same
AssigneeNitto Denko Corporation
InventorsMasaki Sakata, Masayuki Yamamoto
Life of this patent
Estimating the term…
Abstract
An aligned workpiece is mounted on and held by a holding table, and a support board separating mechanism separates a support board from a semiconductor wafer. Herein, a double-faced adhesive tape is left on one of the support board and the semiconductor wafer. Either the support board or the semiconductor wafer on which the double-faced adhesive tape is left is transported to an adhesive tape peeling mechanism while being held by the holding table, and the double-faced adhesive tape is peeled off and removed from the surface of thereof The separated semiconductor wafer and support board are collected independently.
Claims15
An apparatus for separating, from a semiconductor wafer, a support board joined to the semiconductor wafer through a double-faced adhesive tape, the apparatus comprising:
- aligning means for aligning the semiconductor wafer to which the support board is joined;
- holding means on and by which the aligned semiconductor wafer is mounted and held;
- separating means for separating the support board from the semiconductor wafer mounted on and held by the holding means;
- peeling means for peeling off and removing the double-faced adhesive tape left on either a surface of the support board separated by separating means or a surface of the semiconductor wafer;
- a wafer collecting section for collecting the semiconductor wafer that has been subjected to the peeling process by the peeling means;
- a support board collecting section for collecting the separated support board;
- a first transporting robot capable of turning the held support board upside down when transporting the semiconductor wafer to the aligning means and the separating means and, also, transporting the separated support board to the holding means and the support board collecting section;
- and
- a second transporting robot for holding and transporting the semiconductor wafer that has been subjected to the peeling process.
Dependencies are inferred from the claim text.