Conductive ball mounting apparatus

Abstract

A conductive ball mounting apparatus for mounting conductive balls after an adhesive material was applied to individual electrodes formed in a predetermined array pattern on a mounting target adopts the following means is provided. Firstly, the conductive ball mounting apparatus comprises a stage for placing the mounting target, application means for applying the adhesive material to the electrodes of the mounting target placed on the stage, conductive ball mounting means for mounting the conductive balls at positions, to which the adhesive material has been applied, and transfer means for forming a transfer passage for passing the application means and the conductive ball mounting means. Secondly, the stage is disposed over the transfer means through moving means in a direction perpendicular to the transfer direction by the transfer means, and through turning means and vertically moving means.

Dependencies are inferred from the claim text.