Method for causing metallized pattern to be pulled out and attached on gas permeable and moisture absorptive material
AssigneeKlaser Technology Inc.
InventorTom Ku
Life of this patent
Estimating the term…
Abstract
A method for forming fine lines on a gas permeable and moisture absorptive material comprises the following steps: spreading a water-based resin layer on one face of a molding plate with a metallized pattern; covering a carrier made from a gas permeable and moisture absorptive material on the water-based resin layer; allowing the water contained in the water-based resin layer to be carried away; removing the molding plate after said water-based resin layer is harden to be a solidified resin layer and combined firmly with the carrier and the metallized pattern, the metallized pattern on said molding plate being then pulled out and attached to the solidified resin layer to cause the carrier to have the metallized pattern.
Claims13
A method for forming fine lines on a gas permeable and moisture absorptive material, comprising:
- (1) spreading a water-based resin layer onto one face of a molding plate with a metallized pattern;
- (2) covering a carrier made from a gas permeable and moisture absorptive material on said water-based resin layer;
- (3) allowing the water contained in said water-based resin layer to be carried away;
- (4) removing said molding plate after said water-based resin layer is harden to be a solidified resin layer and combined firmly with said carrier and said metallized pattern;
- the material used to form a pattern of said molding plate is not good with regard to the adhesion of a metal material so that said metallized pattern on said molding plate being then pulled out and attached to said solidified resin layer to cause said carrier to have said metallized pattern.
Dependencies are inferred from the claim text.