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AssigneeOTB Group B.V.
InventorsFranciscus Dings, Marinus Franciscus Evers, Michael Adrianus Hompus, Martin Bijker
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A method for treating a surface of at least one substrate, wherein the at least one substrate is placed in a process chamber, wherein the pressure in the process chamber is relatively low, wherein a plasma is generated by at least one plasma source, wherein, during the treatment, at least one plasma source (3) and/or at least one optionally provided treatment fluid supply source is moved relative to the substrate surface. The invention further provides an apparatus for treating a surface of at least one substrate, wherein the apparatus is provided with a process chamber and at least one plasma source, wherein the at least one plasma source (3) and/or at least one optionally provided treatment fluid supply source is movably arranged.
A method far treating a surface of a substrate, wherein the substrate is placed in a process chamber and a plasma is generated by a plasma source, the plasma source being a cascade source, wherein a cathode of the cascade source is present in a prechamber in which, during use, a relatively high pressure prevails compared to a relatively low pressure prevailing in the process chamber, wherein, via a channel bounded by mutually electrically insulated cascade plates, the prechamber opens into the process chamber, such that, during use, the plasma extends via the channel into the process chamber, the method comprising, during the treatment, moving the plasma source and/or a treatment fluid supply source relative to the substrate surface.
An apparatus for treating a surface of a substrate, comprising:
Dependencies are inferred from the claim text.