Method and apparatus for fabricating high fin-density heatsinks
AssigneeR-Theta Thermal Solutions Inc.
InventorAhmed Zaghlol
Life of this patent
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AssigneeR-Theta Thermal Solutions Inc.
InventorAhmed Zaghlol
Estimating the term…
A dual base plate heatsink for use in dissipating heat for electronic devices has sufficient thermal contact between fins and the base plates and is manufactured without the requirement for welding. Separately extruded fins are connected to both base plates by placing the fins side by side in channels in both base plates. In order to couple the base plates and the fins, the base plates are maintained at a constant relative distance and a swaging tool is passed adjacent the fins and between the base plates in a direction parallel to the surface of the base plates. The swaging tool asserts pressure to the base plates to thereby swage the base plates against the ends of the fins. Undesirable warping of the base plates during the process is reduced or prevented by providing a base plate configuration that minimises the bending moment between the swaged base plate material and the rest of the base plate.
A method of manufacturing a dual base plate heatsink, said method comprising:
A swaging tool for use in coupling two opposing heat conducting base plates each having an inward facing surface with a plurality of elongate landing areas separated by an elongate channel, to a plurality of heat conducting fins each having opposing ends, said swaging tool comprising:
A base plate for a dual base plate heatsink made from separately extruded fins, said base plate comprising:
Dependencies are inferred from the claim text.