US 2006/0230610 A1 · Mounting method of electronic components

Abstract

Mounting methods of electronic components in which the electronic components are mounted on plural printed circuit boards are disclosed. An exemplary method includes: supplying a printed circuit board on a first conveyor; transferring the printed circuit board to the third conveyor and simultaneously, transferring the printed circuit board transferred to the first conveyor to the second conveyor; mounting the electronic components to about half-portion of the printed circuit board by moving the printed circuit board to one side and simultaneously, mounting the electronic components to about half-portion from the original position of the printed circuit board and transferring the printed circuit board to a fourth conveyor, simultaneously transferring the printed circuit board to the second conveyor to the third conveyor and then discharging the printed circuit boards sequentially.

Claims7

Dependent claims

An electronic component mounting method,:

comprising:
transferring a first printed circuit board from a first conveyor to a second conveyor while simultaneously supplying a second printed circuit board to the first conveyor;
shifting the second conveyor holding the first printed circuit board from a first position to a second position;
and
mounting electronic components to the first printed circuit board while simultaneously mounting electronic components to the second printed circuit board.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

11/452,339Filed 14 Jun 2006

Priority

KR 2001-7280021 Nov 2001

Published

19 Oct 2006

Term ends

Not estimatedThe source records don’t support an estimate.

Classification16 codes

H05K 3/0097
Apparatus or processes for manufacturing printed circuits: processing two or more printed circuits simultaneously, e.g. made from a common…
H05K 13/0061
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components: tools for holding the circuit boards…
H05K 13/085
Monitoring manufacture of assemblages: production planning, e.g. of allocation of products to machines, of mounting sequences at machine or…
H05K 3/303
Assembling printed circuits with electric components, e.g. with resistors: with surface mounted components

Mounting method of electronic components

Life of this patent

Mounting method of electronic components

Life of this patent

Abstract

Claims7