Semiconductor integrated circuit
AssigneeKabushiki Kaisha Toshiba
InventorsTakashi Inukai, Yukihiro Urakawa
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Abstract
A semiconductor integrated circuit according to the examples of the present invention is applied to a system using a first power source voltage and a second power source voltage independent of the first power source voltage and includes a first area to which the first power source voltage is supplied, a thermal sensor placed in the first area, and a first input path placed in the first area, for transferring trimming data that determine the control contents of the thermal sensor to the thermal sensor.
Claims30
A semiconductor integrated circuit having a system which uses first and second power source voltages independently, comprising:
- a first area to which the first power source voltage is supplied;
- a thermal sensor placed in the first area;
- and
- a first input path which is disposed in the first area and transfer trimming data, which determine control contents of the thermal sensor, to the thermal sensor.
A trimming test method of a thermal sensor which is provided in a first area different from a second area comprising:
- supplying a first power source voltage to the first area;
- inputting trimming data to the thermal sensor making use of a first input path disposed in the first area;
- and
- calibrating the temperature of the thermal sensor based on the trimming data.
Dependencies are inferred from the claim text.