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US 2006/0223933 A1Published application
Cure system, adhesive system, electronic device
AssigneeGeneral Electric Company
InventorSlawomir Rubinsztajn
Life of this patent
Estimating the term…
Abstract
A cure system including a compatiblized and passivated refectory solid dispersed within a low temperature liquid curing agent is provided. An adhesive system including the cure system is provided, and an associated method. A device including the cured adhesive system is provided.
Claims28
A cure system, comprising:
- a curing agent that is a low temperature liquid;
- and
- a finely divided refractory solid, wherein the solid is non-reactive relative to the curing agent.
A solvent-free adhesive system for use in an electronic device, comprising:
- a curable resin comprising a first portion of refractory solid;
- and
- a cure system operable to cure the resin, the cure system comprising a curing agent and a second portion of refractory solid, wherein the refractory solid is present in an amount greater than about 30 percent by weight relative to the total weight of the adhesive system.
Dependencies are inferred from the claim text.