Flame retardant and an epoxy resin composition comprising the same for encapsulating semiconductor devices
AssigneeShin-Etsu Chemical Co., Ltd.
InventorShoichi Osada
Life of this patent
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Abstract
A flame retardant comprising an inorganic porous fine particle, a phosphazene compound represented by the following average compositional formula (1) wherein X is selected from the group consisting of a single bond, CH2, C(CH3)2, SO2, S, O, and O(CO)O, n is an integer of from 3 to 1000, d and e are numbers with 2d+e=2n, said phosphazene compound being supported on said inorganic porous fine particle, and a resin layer coating said inorganic porous fine particle with the phosphazene compound supported thereon, said resin thermally decomposing to lose weight by 10% at a temperature of from 300° C. to 500° C. as measured by thermogravimetry in the air at a heating rate of 10° C./min.
Claims6
A flame retardant comprising
- an inorganic porous fine particle,
- a phosphazene compound represented by the following average compositional formula (1)
- wherein X is selected from the group consisting of a single bond, CH2, C(CH3)2, SO2, S, O, and O(CO)O, n is an integer of from 3 to 1000, d and e are numbers with 2d+e=2n,
- said phosphazene compound being supported on said inorganic porous fine particle, and
- a resin layer coating said inorganic porous fine particle with the phosphazene compound supported thereon, said resin thermally decomposing to lose weight by 10% at a temperature of from 300° C. to 500° C. as measured by thermogravimetry in the air at a heating rate of 10° C./min.
Dependencies are inferred from the claim text.