Back to results
US 2006/0223903 A1Published application
Radiation-curable desiccant-filled adhesive/sealant
AssigneeHenkel AG & Co. KGaA
InventorsJie Cao, Donald Herr
Life of this patent
Estimating the term…
Abstract
A radiation-curable desiccant-filled adhesive/sealant composition comprising a radiation-curable resin, one or more desiccant fillers, one or more photoinitiators or photosensitizers, and optionally, one or more inorganic or organic fillers.
Claims6
A radiation-curable desiccant-filled adhesive/sealant composition comprising:
- a) a radiation-curable resin,
- b) one or more desiccant fillers,
- c) a photoinitiating system comprising one or more photoinitiators and optionally one or more photosensitizers,
Dependencies are inferred from the claim text.