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US 2006/0223690 A1Published application
Photosensitive thick-film dielectric paste composition and method for making an insulating layer using same
OwnerTsutomu Mutohinventor
Life of this patent
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Abstract
Disclosed is a photosensitive thick-film dielectric paste composition that includes a glass frit having a glass softening point not lower than 0° to 40° C. below a firing temperature ranging above 450° C. and up to 600° C.; an organic polymer binder; a photoinitiator; a photocurable monomer; and an organic solvent, wherein the composition is aqueous-developable upon exposure to actinic radiation. A method for forming an insulating layer using the composition is also provided.
Claims22
A photosensitive thick-film dielectric paste composition, comprising:
- (a) a glass frit having a glass softening point not lower than 0° to 40° C. below a firing temperature ranging above 450° C. and up to 600° C.;
- (b) an organic polymer binder;
- (c) a photoinitiator;
- (d) a photocurable monomer;
- and,
- (e) an organic solvent, wherein the composition is aqueous-developable upon exposure to actinic radiation.
3 more elements
A method for forming an insulating layer in a display panel, comprising the steps of:
- (a) providing a glass substrate;
- (b) coating the substrate with a conductive thick film composition;
- (c) firing the substrate and conductive composition of step (b) to form an electrode;
- (d) printing a dielectric paste composition comprising a glass frit onto a surface of the electrode of step (c);
- (e) imagewise exposing selected areas of the dielectric composition of step (d) with actinic radiation to form exposed and unexposed areas;
- (f) developing the unexposed areas formed in step (e) in an aqueous medium;
- and
- (g) firing the exposed dielectric paste composition of step (f) at a temperature ranging above 450° C. and up to 600° C., wherein the glass softening point of the glass frit is not lower than 0° C. to 40° C. below the firing temperature.
5 more elements
Dependencies are inferred from the claim text.