Polishing Pad
AssigneeInnopad, Inc.
InventorsJean VANGSNESS, Oscar HSU, Alaka POTNIS
Life of this patent
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Abstract
An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.
Claims35
A pad for polishing a substrate comprising:
- a first component comprising a needle-punched non-woven fiber web of a basis weight of about 100-2500 g/m2 and a second component comprising a polymer matrix component, said fibrous component distributed in said polymer matrix component, wherein said pad is characterized as having a Shore D hardness of between about 10 D to 70 D, said fiber web present at a level of about 10-90% (wt).
A process of polishing a substrate using a polishing pad, comprising:
- (a) a pad formed from a two-component system, a first component comprising a needle-punched non-woven fiber web of a basis weight of about 100-2500 g/m2 and a second component comprising a polymer matrix component, said fibrous component distributed in said polymer matrix component, wherein said pad is characterized as having a Shore D hardness of between about 10 D to 70 D, said fiber web present at a level of about 10-90% (wt)
- providing a substrate to be polished;
- providing a slurry;
- and
- polishing the substrate with the slurry using the pad.
A pad for polishing a substrate comprising a needle-punched non-woven fiber web of a basis weight of about 100-2500 g/m2, wherein said pad is characterized as having a Shore D hardness of between about 10 D to 70 D.
A process for manufacturing a polishing pad, comprising the steps of:
- (a) providing a non-woven fibrous component basis weight of 100-2500g/m2;
- (b) subjecting said non-woven fibrous component to a temperature range “T” and pressure to set density and thickness and wherein said pad has a Shore D hardness of between about 10 D to 70 D.
Dependencies are inferred from the claim text.