Sockets for "springed" semiconductor devices
AssigneeFormFactor, Inc.
InventorsThomas Dozier, Benjamin Eldridge, Gary Grube, Igor Khandros, Gaetan Mathieu, David Pedersen, Michael Stadt
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Abstract
Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.
Claims6
1-8. (canceled)
An interconnection substrate for receiving an elongate spring contact element, the interconnection substrate comprising:
- an interconnection substrate with a terminal which is a plated through hole, the hole designed to receive a corresponding elongate spring contact element and form an electrical connection therewith.
13-17. (canceled)
Dependencies are inferred from the claim text.