US 2006/0223343 A1 · Stacked multiple connection module

Abstract

A stacked multiple connection module that provides multiple times the input/output (I/O) signal capacity of a single connection module. In one embodiment, a stacked dual connection module includes first and second circuit boards with respective edge connectors maintained at a parallel offset and configured to couple to a mating two slotted stacked edge connector. A connection means is provided to couple signals between the first and second circuit boards, such that components mounted on the first and/or second circuit board are enabled to access I/O signals via both of the edge connectors, thus doubling I/O signal capacity. In one embodiment, the stacked dual connection module comprises an Advanced Mezzanine Card (AdvancedMC) module having edge connectors configured to mate with an AdvancedMC connector.

Claims22

Dependent claims

An apparatus comprising:

a carrier board,
a first circuit board having a first edge connector;
a second circuit board having a second edge connector at one end of the second circuit board and a third edge connector at an opposing end of the second circuit board;
a first slotted connector having a first slot into which the first edge connector is inserted and a second slot into which the second edge connector is inserted and having a base mounted to the carrier board, the first and second circuit boards extending outward from the slotted connector in a cantilevered fashion:
a second slotted connector having a third slot into which the third edge connector is inserted and having a base mounted to the first circuit board, the second circuit board extending outward from the slotted connector in a cantilevered fashion, and
means for maintaining a parallel offset distance between the first and second circuit boards.

3 more elements

Dependencies are inferred from the claim text.

Stacked multiple connection module

Life of this patent

Stacked multiple connection module

Life of this patent

Abstract

Claims22