Manufacturing managing method of semiconductor devices and a semiconductor substrate
AssigneeFujitsu Limited
InventorYoshiyuki Yoneda
Life of this patent
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Abstract
A managing method of manufacturing semiconductor devices is disclosed. The method comprises the steps of: providing at least one tag region on a semiconductor substrate in which plural semiconductor devices have been formed, the tag region being provided with a tag which can read/write information without making physical contact; writing manufacturing managing information of each of the semiconductor devices into the tag without making contact with the semiconductor substrate; and reading the manufacturing managing information from the tag after dividing the semiconductor substrate, and selecting non-defective semiconductor devices based on the manufacturing managing information.
Claims10
A managing method of manufacturing a plurality of semiconductor devices, comprising the steps of:
- providing at least one tag region on a semiconductor substrate in which the semiconductor devices are formed, the tag region being provided with a tag which can read/write information without being contacted;
- writing manufacturing managing information of each of the semiconductor devices into the tag without contacting the semiconductor substrate;
- and
- reading the manufacturing managing information from the tag after dividing the semiconductor substrate, and selecting non-defective semiconductor devices based on the manufacturing managing information.
A semiconductor substrate comprising a plurality of semiconductor devices and a tag region including a tag from/into which information can be read/written.
Dependencies are inferred from the claim text.