Copper interconnect post for connecting a semiconductor chip to a substrate and method of fabricating the same

A method for manufacturing a semiconductor chip with a copper interconnect post comprising:

• depositing a seed layer on a surface of the semiconductor chip comprising at least one contact pad;
• the contact pad with the seed layer thereon defining a contact area;
• applying a photosensitive dry film to a surface of the seed layer;
• processing the dry film so as to expose the contact area of the semiconductor chip via a through-hole in the dry film;
• filling at least a substantial portion of the through-hole with copper thereby forming a copper post, a base surface thereof being in direct contact with the contact area of the semiconductor chip;
• and
• removing the dry film.

A semiconductor device including:

• a semiconductor chip comprising
• at least one contact area for electrically connecting the chip to a substrate;
• the contact area comprising a metallic contact pad covered by a seed layer;
• and
• at least one copper interconnect post having a base surface directly contacting the contact area and extending from the contact area in a direction at least substantially perpendicular thereto in a tapered manner.