Semiconductor device and method of manufacturing the same
AssigneeSeiko Epson Corporation
InventorYasunori Kurosawa
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a semiconductor device includes the step of forming a first insulating section with a protruding section on a semiconductor substrate, the step of forming a first conducting section on the first insulating section so as to pass on a surface of the protruding section, the step of forming a second insulating section for partially covering the first conducting section above the first insulating section so as to expose at least a part of the first conducting section formed on the surface of the protruding section, and the step of forming, on the second insulating section, a second conducting section electrically connected to the first conducting section via an exposed section of the first conducting section exposed from the second insulating section.
Claims12
A method of manufacturing a semiconductor device, comprising:
- forming a first insulating section with a protruding section on a semiconductor substrate;
- forming a first conducting section on the first insulating section so as to pass on a surface of the protruding section;
- forming a second insulating section above the first insulating section for partially covering the first conducting section so as to expose at least a part of the first conducting section formed on the surface of the protruding section;
- and
- forming, on the second insulating section, a second conducting section electrically connected to the first conducting section via an exposed section of the first conducting section exposed from the second insulating section.
A semiconductor device, comprising:
- a substrate;
- a first insulating section with a protruding section provided on the substrate;
- a first conducting section provided on the first insulating section so as to pass on a surface of the protruding section;
- a second insulating section for partially covering the first conducting section provided above the first insulating section so as to expose at least a part of the first conducting section formed on the surface of the protruding section;
- and
- a second conducting section provided on the second insulating section, and electrically connected to the first conducting section via an exposed section of the first conducting section exposed from the second insulating section.
Dependencies are inferred from the claim text.