Electronic device fabrication
AssigneeHewlett-Packard Development Company, L.P.
InventorsGregory Herman, Darin Peterson, Martin Manning
Life of this patent
Estimating the term…
Abstract
A system performs a method including contact printing one of a wetting agent and a non-wetting agent on a semiconductor and inkjet printing an electrically conductive material proximate said one of the wetting agent and the non-wetting agent.
Claims49
A method comprising:
- contact printing one of a wetting agent and a non-wetting agent on a semiconductor;
- and
- inkjet printing an electrically conductive material proximate said one of the wetting agent and the non-wetting agent.
A system comprising:
- a first contact printing station configured to contact print one of a wetting agent and a non-wetting agent on a semiconductor;
- and
- an inkjet station configured to inkjet print an electrically conductive material proximate said one of the wetting agent and the non-wetting agent.
The system of claim 42 including a third inkjet station configured to inkjet print a dielectric on the electrically conductive material, wherein the second inkjet station is configured to inkjet print the electrically conductive material on the dielectric.
The system of claim 44 including a third inkjet station configured to inkjet print a dielectric on the electrically conductive material, wherein the second inkjet printing station is configured to inkjet print the electrically conductive material on the dielectric.
A system comprising:
- means for contact printing one of a wetting agent and a non-wetting agent on a semiconductor;
- and
- means for inkjet printing an electrically conductive material proximate said one of the wetting agent and the non-wetting agent.
A thin film transistor formed by contact printing one of a wetting agent and a non-wetting agent on a semiconductor and inkjet printing an electrically conductive material proximate said one of the wetting agent and the non-wetting agent.
Dependencies are inferred from the claim text.