Method of making substrate for integrated circuit
AssigneeLingsen Precision Industries, Ltd.
InventorHsin-Chen Yang
Life of this patent
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Abstract
A method of making an IC substrate includes the steps of: a) preparing a substrate having a front side and a back side and half-etching the substrate to form a filling space in the front side of the substrate subject to a predetermined depth and area, b) putting the substrate thus obtained from step a) in a cavity of a mold and employing a polymer filling and mold pressing procedure to fill up the filling space with an insulative polymer, and c) removing the substrate from the mold and half-etching the back side of the substrate body so as to obtain an IC substrate.
Claims3
A method of making an IC substrate, comprising the steps of:
- a) preparing a substrate having a front side and a back side and half-etching said substrate to form a filling space in the front side of said substrate subject to a predetermined depth and area;
- b) putting the substrate thus obtained from step a) in a cavity of a mold and employing a polymer filling and mold pressing procedure to fill up said filling space with an insulative polymer;
- and
- c) removing said substrate from said mold and half-etching the back side of the substrate body so as to obtain an IC substrate.
Dependencies are inferred from the claim text.