Back to results
US 2006/0223237 A1Published application
Method of manufacturing enhanced thermal dissipation integrated circuit package
OwnerEdward Combs, Robert Sheppard +4inventors
InventorsEdward Combs, Robert Sheppard, Tai Pun, Hau Ng, Chan Fan, Neil McLellan
Life of this patent
Estimating the term…
Abstract
The present invention relates to an integrated circuit package having a thermally conductive element thermally coupled to a semiconductor die and a heat sink, and a method of manufacturing said integrated circuit package. The thermally conductive element is integrated into the package to enhance thermal dissipation characteristics of the package.
Claims5
A method of manufacturing an integrated circuit package, comprising:
- installing a carrier onto an upper surface of a substrate, wherein said carrier defines a cavity;
- attaching a semiconductor die to said upper surface of said substrate within said cavity of said carrier;
- aligning an assembly over said semiconductor die, wherein said assembly comprises a heat sink and a thermally conductive element;
- resting said assembly on said carrier such that said thermally conductive element does not directly contact said semiconductor die;
- and
- encapsulating said cavity to form a prepackage such that a portion of said heat sink is exposed to the surroundings of said package.
3 more elements
A method of manufacturing an integrated circuit package, comprising:
- installing a carrier onto a substrate;
- attaching a semiconductor die to said substrate;
- aligning an assembly over said semiconductor die, wherein said assembly comprises a heat sink and a thermally conductive element;
- resting said assembly on said carrier such that said thermally conductive element does not directly contact said semiconductor die;
- and
- encapsulating said thermally conductive element and said heat sink such that a portion of said heat sink is exposed to the surroundings of said package.
3 more elements
Dependencies are inferred from the claim text.