Method of manufacturing flexible circuit substrate
AssigneeShinko Electric Industries Co., Ltd.
InventorsTomohiro Nomura, Kazunori Abe
Life of this patent
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Abstract
Connection pads and alignment marks are formed on a long metal thin plate that is carried in a longitudinal direction, and then an insulating layer for covering the connection pads is formed. Then, via holes, which are aligned and arranged on the connection pads by utilizing the alignment marks, are formed in portions of the insulating layer. Then, n-layered (n is an integer of 1 or more) wiring layers connected to the connection pads via the via holes are formed, and the connection pads and the insulating layer are exposed by removing the metal thin plate.
Claims17
A method of manufacturing a flexible circuit substrate, comprising:
- forming a connection pad and an alignment mark on a long metal thin plate that is carried in a longitudinal direction;
- forming an insulating layer to cover the connection pad;
- forming a via hole, which is aligned and arranged on the connection pad by utilizing the alignment mark, in a portion of the insulating layer;
- and
- forming n-layered (n is an integer of 1 or more) wiring layers connected to the connection pad via the via hole.
A flexible circuit substrate, comprising:
- a long metal thin plate;
- a connection pad and an alignment mark formed on the metal thin plate;
- an insulating layer covering the connection pad and having a via hole, which is aligned and arranged on the connection pad, in a portion of the insulating layer;
- and
- n-layered (n is an integer of 1 or more) wiring layers formed on the insulating layer and connected to the connection pad via the via hole.
Dependencies are inferred from the claim text.