Ball grid array package and process for manufacturing same

An integrated circuit package comprising:

• a substrate having a plurality of conductive traces;
• a semiconductor die flip-chip mounted to a first surface of said substrate, bumps of said semiconductor die being electrically connected to said ones of said plurality of conductive traces;
• a heat spreader fixed to both said semiconductor die and said substrate by a plurality of collapsible spacers, one of said collapsible spacers disposed between and in contact with said heat spreader and said semiconductor die and further ones of said collapsible spacers disposed between and in contact with said heat spreader and said substrate;
• and
• a ball grid array on a second surface of said substrate, bumps of said ball grid array being electrically connected to said conductive traces;
• and
• a molding compound encapsulating the semiconductor die and said collapsible spacers between the substrate and the heat spreader.

An integrated circuit package comprising:

• a substrate having a plurality of conductive traces;
• a semiconductor die flip-chip mounted to a first surface of said substrate, bumps of said semiconductor die being electrically connected to said ones of said plurality of conductive traces;
• a heat spreader fixed to both said semiconductor die and said substrate by a plurality of collapsible spacers, one of said collapsible spacers disposed between and in contact with said heat spreader and said semiconductor die and further ones of said collapsible spacers disposed between and in contact with said heat spreader and said substrate;
• and
• a ball grid array on a second surface of said substrate, bumps of said ball grid array being electrically connected to said conductive traces, wherein said collapsible spacers comprise one of solder and a thermoplastic;
• and
• a molding compound encapsulating the semiconductor die and said collapsible spacers between the substrate and the heat spreader.