Ceramic substrate and method of breaking same

A ceramic substrate breaking method, wherein the ceramic substrate comprises a top surface and a bottom surface, the top surface defining a first area located at one or more edge portions thereof, and a second area located inside the first area, a plurality of identification marks arranged on the first area, the bottom surface defining a plurality of grooves corresponding to the identification marks, the method comprising the steps of:

• (a) covering a protective compound on the second area of the top surface of the ceramic substrate;
• (b) cutting the protective compound according to the identification marks on the top surface of the ceramic substrate;
• and
• (c) breaking the ceramic substrate into individual circuit unit pieces along the grooves.

A ceramic substrate breaking method, wherein the ceramic substrate comprises a top surface and a bottom surface, the top surface defining a first area located at one or more edge portions thereof, and a second area located inside the first area, a plurality of identification marks arranged on the first area, a plurality of circuit units embedded at the second area, the bottom surface defining a plurality of grooves corresponding to the identification marks, wherein at least two of the identification marks correspond to clearances between adjacent circuit units, the method comprising the steps of:

• (a) pasting one or more tapes on the first area of the top surface of the ceramic substrate;
• (b) covering the protective compound on the second area of the top surface of the ceramic substrate;
• (c) removing the tapes;
• (d) cutting the protective compound according to the identification marks;
• and
• (e) breaking the ceramic substrate into individual circuit unit pieces along the grooves at the bottom surface of the ceramic substrate.