Molding method for foldover package
AssigneeTessera, Inc.
InventorsYoichi Kubota, Ellis Chau, Teck-Gyu Kang, Jae Park
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Abstract
A method of making a microelectronic assembly including the steps of depositing one or more microelectronic elements onto a flexible substrate and folding the substrate so that a first region of the substrate forms a first run and a second region of the substrate forms a second run overlaying the first run. The first run and the second run form a pocket therebetween. While temporarily maintaining the folded structure, providing an encapsulant material into the pocket. The encapsulant material is next cured, so that the cured encapsulant material holds the flexible substrate in the folded state.
Claims15
A method of making a microelectronic assembly comprising the steps of:
- depositing one or more microelectronic elements onto a flexible substrate;
- folding said substrate into a folded state so that a first region of said substrate forms a first run and a second region of said substrate forms a second run overlaying said first run, said first run and said second run forming a pocket therebetween, said one or more microelectronic elements being disposed in said pocket;
- temporarily maintaining said folded state while providing an encapsulant material into said pocket;
- and
- curing said encapsulant material so that said cured encapsulant material holds said flexible substrate in said folded state.
Dependencies are inferred from the claim text.