Method, system, and apparatus for transfer of integrated circuit dies using an attractive force
AssigneeSymbol Technologies, Inc.
InventorsMichael Arneson, William Bandy
Life of this patent
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Abstract
A method, system, and apparatus for transferring integrated circuit dies is described. A die receptacle structure has a first surface. The first surface has a plurality of cells formed therein. Each cell is configured to contain an integrated circuit die. A bottom surface of each cell is configured to attract dies having a first material thereon. Example forces that can be used to attract dies into cells include a magnetic force, a chemical force, and an electrostatic force.
Claims22
A method for transferring a plurality of integrated circuit dies, comprising:
- (a) receiving a plurality of dies, wherein each die of the plurality of dies has a surface at least partially covered with a first material;
- and
- (b) transferring dies of the plurality of dies into cells formed in a first surface, wherein the dies are transferred into the cells due to an attraction between the first material and the cells.
A system for transferring a plurality of integrated circuit dies, comprising:
- a die receptacle structure having a first surface, wherein the first surface has a plurality of cells formed therein, each cell configured to contain an integrated circuit die;
- wherein a bottom surface of each cell is configured to attract dies having a first material thereon.
Dependencies are inferred from the claim text.