Method of production of circuit board utilizing electroplating

A method of production of a circuit board utilizing electroplating comprising the steps of:

• forming through holes in an insulating board clad on its surface with a metal foil,
• forming a first electroless plating layer on said metal foil and at the inside walls of said through holes,
• forming first plating resist patterns on said first electroless plating layer so as to expose only first predetermined locations,
• using said first electroless plating layer as a power feed layer for electroplating to form a first electroplating layer on the first electroless plating layer exposed at said first predetermined locations to form circuit patterns,
• removing said first plating resist patterns to expose the underlying first electroless plating layer,
• removing said exposed first electroless plating layer and the underlying metal foil to expose the surface of said insulating board,
• forming a second electroless plating layer on the surface of said exposed insulating board and on said circuit patterns including the insides of said through holes,
• forming second plating resist patterns so as to expose only second predetermined locations of said second electroless plating layer and said circuit patterns,
• removing said second electroless plating layer exposed at said second predetermined locations,
• using said second electroless plating layer under said second plating resist pattern as a power feed layer for electroplating to form a second electroplating layer on said circuit patterns exposed at said second predetermined locations,
• removing said second plating resist patterns to expose the underlying second electroless plating layer, and
• removing said exposed second electroless plating layer.