Microelectronic imaging units and methods of manufacturing microelectronic imaging units

A plurality of microelectronic imaging units, comprising:

• a support member having a plurality of terminal arrays;
• a plurality of imaging dies including a first side, a second side attached to the support member, an image sensor on the first side, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit;
• a plurality of covers attached to the first side of corresponding dies and positioned over associated image sensors;
• a plurality of wire-bonds electrically connecting the external contacts on the dies to corresponding terminals on the support member;
• and
• a barrier on the support member between adjacent imaging dies.

A plurality of microelectronic imaging units, comprising:

• a support member;
• a plurality of singulated imaging dies attached to the support member, the individual imaging dies comprising an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit;
• a plurality of covers attached to corresponding dies, the individual covers being positioned inboard the associated external contacts and over the image sensor;
• a plurality of dams on corresponding imaging dies, the individual dams forming a perimeter around the associated cover;
• and
• a fill material on the support member between adjacent imaging dies.

A plurality of microelectronic imaging units, comprising:

• a support member having a plurality of terminal arrays;
• a plurality of imaging dies including a first side, a second side attached to the support member, an image sensor on the first side, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit;
• a plurality of covers attached to the first side of corresponding dies and positioned over associated image sensors;
• a fill material on the support member between adjacent dies;
• means for inhibiting the fill material from covering the covers;
• and
• means for electrically connecting the external contacts on the dies to corresponding terminals.

A microelectronic imaging unit, comprising:

• a support member including a base, a plurality of sidewalls projecting from the base, a recess defined by the sidewalls and the base, and a plurality of terminals in the base and/or the sidewalls;
• an imaging die received in the recess and attached to the base, the imaging die including an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit;
• a cover attached to the imaging die and positioned over the image sensor;
• a plurality of wire-bonds electrically connecting the external contacts of the imaging die to corresponding terminals on the support member;
• and
• a fill material in the recess of the support member between the imaging die and the sidewalls.