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US 2006/0223011 A1Published application
Method for manufacturing optical semiconductor element, and optical semiconductor element
AssigneeSeiko Epson Corporation
InventorTsuyoshi Kaneko
Life of this patent
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Abstract
A method for manufacturing an optical semiconductor element having a light emitting element section and a functional section. The method includes conducting dry etching, and then conducting wet etching, when forming at least a part of the functional section.
Claims15
A method for manufacturing an optical semiconductor element having a light emitting element section and a functional section, the method comprising:
- conducting dry etching, and then conducting wet etching, when forming at least a part of the functional section.
A method for manufacturing an optical semiconductor element, comprising:
- a first process of forming, above a substrate, a first semiconductor layer composed of a first conductivity type, a second semiconductor layer that functions as an active layer, a third semiconductor layer composed of a second conductivity type and a fourth semiconductor layer;
- a second process of forming at least a part of a functional section by patterning at least a part of the fourth semiconductor layer;
- a third process of forming the functional section and a light emitting element section by patterning at least the third semiconductor layer;
- a fourth process of forming first and second electrodes for driving the light emitting element section;
- and
- a fifth process of forming a third electrode that connects the light emitting element section with the functional section,
- wherein dry etching is conducted and thereafter wet etching is conducted in the second process to thereby form at least a part of the functional section.
4 more elements
Dependencies are inferred from the claim text.