Photosensitive composition and cured products thereof
AssigneeAsahi Kasei Chemicals Corporation
InventorsKuon Miyazaki, Hideaki Takahashi
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Abstract
There is provided a photosensitive composition excellent in photo-curability which comprises an epoxy compound having two or more epoxy groups, a polynuclear phenol compound having a specific structure and an energy beam-sensitive cationic polymerization initiator, and optionally a predetermined percentage of a hydroxyl group-containing compound having one or more hydroxyl groups and one or more of at least one of a vinyl ether group and an oxetanyl group in a molecule, and a cured product of the same whose film is excellent in adhesion to various substrates, water resistance and flexibility.
Claims14
A photosensitive composition characterized by comprising:
- from 30 to 90 percent by weight of an epoxy compound (a) having two or more epoxy groups in a molecule;
- from 0.1 to 40 percent by weight of a polynuclear phenol compound (b) comprising three to five phenolic aromatic rings, wherein either of the ortho positions of each hydroxyl group is not substituted with any of a methylol group, or an alkyl group or cycloalkyl group having four or more carbon atoms and each of two or more of the phenolic aromatic rings has at least one unsubstituted position ortho to the hydroxyl group;
- and
- from 0.1 to 10 percent by weight of an energy beam-sensitive cationic polymerization initiator (c).
The photosensitive coating material according to 13, wherein the alkoxysilane is tetraethoxysilane.
Dependencies are inferred from the claim text.