US 2006/0222871 A1 · Method for lowering deposition stress, improving ductility, and enhancing lateral growth in electrodeposited iron-containing alloys

Abstract

The present invention provides an electrodeposition/plating method for metal films and alloys in a bath which contain ferric ions and which usually deposit with high stress, but which when electrodeposited under pulse plating conditions in the presence of low valence vanadium or other ions capable of existing in multiple valence states produce low stress films and alloys and furthermore when plated through a mask creep laterally through walls and creep laterally along the surface of the mask to permit formation of overhangers, bridges, heat exchangers, and other complex three dimensional micro structures of low stress.

Claims43

Dependent claims

A method for electrodeposition, comprising:

creating a bath containing metallic ions, ferric ions, and an effective amount of an additive operative to reduce a tensile stress of a material formed in the bath as compared to a material formed in an otherwise identical bath not having the additive;
and
pulsing an electrical current through the bath at predetermined intervals for forming an electrodeposited structure of low tensile stress.

Dependencies are inferred from the claim text.

Method for lowering deposition stress, improving ductility, and enhancing lateral growth in electrodeposited iron-containing alloys

Life of this patent

Method for lowering deposition stress, improving ductility, and enhancing lateral growth in electrodeposited iron-containing alloys

Life of this patent

Abstract

Claims43