Radiopaque polymers for circuit board assembly
AssigneeDelphi Technologies, Inc.
InventorsRafil Basheer, Derek Workman
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Abstract
The thermosetable composition incorporating organo-iodine compounds that provide improved x-ray contrast are prepared by reacting an epoxy resin with crosslinking agents, wherein the crosslinking agents include compounds having iodo-phenyl functionalities, and wherein the iodine atoms include iodine-127 isotope. The resulting thermoset material includes sufficient iodine-127 isotope covalently bound to the polymer matrix to impart excellent x-ray contrast. The cured polymer materials of this invention may be utilized as underfill material for electrical components, thereby facilitating use of x-ray analysis to detect problematic voids in the underfill.
Claims21
A thermosetable composition, comprising:
- an epoxy resin;
- and
- an organo-iodine crosslinking agent.
A thermoset material comprising:
- a crosslinked epoxy resin having iodine atoms covalently bound to the crosslinked resin.
An electrical component comprising:
- a circuit board;
- an electrical device mounted on the circuit board, the electrical device being spaced from the circuit board;
- and
- a cross-linked epoxy resin underfill disposed between the circuit board and the electrical device, the crosslinked epoxy resin having covalently bound iodine atoms.
Dependencies are inferred from the claim text.