Prepreg for printed wiring board and copper-clad laminated board
OwnerKatsuhiko Itou, Akinori Hibino +1inventors
InventorsKatsuhiko Itou, Akinori Hibino, Hidetsugu Motobe
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Abstract
A prepreg for a printed wiring board characterized with use of a brominated epoxy resin, possessing a peak intensity of infrared absorption spectrum at 2100 to 2300 cm−1, which is 5% or lower than that of a benzene ring carbon-carbon double bond at 1600 cm−1 as measured with an infrared absorption spectrometer as well as having an inflection point between 120 and 150° C. in the cured product of said brominated epoxy resin as measured by means of a differential scanning calorimeter. The prepreg for the printed wiring board is superior in hygroscopicity, heat resistance, and desmear capability as a printed wiring board material and can be used to manufacture a copper-clad laminate board.
Claims10
A prepreg for a printed wiring board, characterized in that a brominated epoxy resin is used, which provides a cured product of said brominated epoxy resin having an inflection point in the range of 120° C. to 150° C., as measured by a differential scanning calorimeter;
- a peak intensity of infrared absorption spectrum at 2100 to 2300 cm−1 of said brominated epoxy resin being 5% or less of a peak intensity around 1600 cm−1 due to a benzene ring carbon-carbon double bond, as measured with an infrared absorption spectrometer.
A prepreg for a printed wiring board, which prepreg is obtainable by impregnating a substrate with the above brominated epoxy resin, drying it and semi-curing it with a curing agent, characterized in that, as the curing agent, is used a phenol type curing agent having, within the molecule, average two or more phenolic hydroxyl groups reactive with an epoxy resin.
Dependencies are inferred from the claim text.