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AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsIl Maeng, Myeong Hong, Choon Lee, Jeong Kwak, Jae Cho, Seung Ra
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The present invention relates to an imprinting mold for a printed circuit board, having excellent durability, and a method of manufacturing a printed circuit board using the same. Specifically, this invention provides an imprinting mold for a printed circuit board, having excellent durability, in which the mold having a surface structure corresponding to a plurality of via holes and a pattern to be formed is prepared by incorporating 30-80 parts by weight of a filler, having an average particle size of 0.1-5.0 μm, into 100 parts by weight of a heat or UV curing prepolymer. In addition, a method of manufacturing a printed circuit board using the imprinting mold is provided.
An imprinting mold for a printed circuit board, comprising a surface structure corresponding to a plurality of via holes and a pattern to be formed, which is prepared by incorporating 30-80 parts by weight of a filler having an average particle size of 0.1-5.0 μm into 100 parts by weight of a heat or UV curing prepolymer.
Dependencies are inferred from the claim text.