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AssigneeTDK Corporation
InventorTaku Masai
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A composite substrate capable of suppressing a deformation of the substrate in response to the influence of internal stress of a conductive film is provided. When a conductive film is formed on a substrate, the conductive film is formed so as to have a laminated structure including a main conductive film which has a tensile stress FT as its internal stress F1 and a sub-conductive film which has a compressive stress FC as its internal stress F2. In this manner, the tensile stress FT of the main conductive film is offset by use of the compressive stress FC of the sub-conductive film. Thereby, unlike the case where the conductive film is formed so that only the main conductive film may be included without including the sub-conductive film, the substrate becomes less deformable in response to the influence of the internal stress F of the conductive film.
A composite substrate comprising a conductive film having a laminated structure on a substrate, the laminated structure including a first conductive film with a tensile stress and a second conductive film with a compressive stress.
A thin film device comprising on a substrate:
A method of manufacturing a composite substrate comprising a substrate and a conductive film thereon having a laminated structure,
A method of manufacturing a thin film device on a substrate, the thin film device comprising:
Dependencies are inferred from the claim text.