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US 2006/0222796 A1Published application
Structure comprising metallized film and ethylene copolymer
OwnerBarry Morrisinventor
Life of this patent
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Abstract
Disclosed are a multilayer structure, an article therewith, and a process therefor. The article includes packages such as pouch. The structure comprises a metallized film and an ethylene copolymer composition. The process is a lamination process or extrusion coating process with the ethylene copolymer composition providing adhesion of metallized film to a substrate.
Claims20
A multilayer structure comprising, or produced from, (a) at least one layer of metallized film;
- (b) at least one composition comprising or produced from an ethylene copolymer;
- (c) optionally at least one substrate, and (d) optionally at least one additional layer wherein the substrate comprises or is produced from a thermoplastic film, paper, paperboard, or combinations of two or more thereof;
- the additional layer comprises or is produced from polyester, polyamide, polyethylene vinyl alcohol, polyethylene vinyl acetate, ethylene/acrylic acid copolymer, ionomer of ethylene/acrylic acid copolymer, polyvinylidene chloride, anhydride-modified ethylene polymer, or combinations of two or more thereof;
- and the thermoplastic film comprising, or produced from, ethylene/acrylic acid copolymer, ionomer of the ethylene/acrylic acid copolymer, ethylene vinyl acetate copolymer, polyethylene terephthalate, polypropylene, polyethylene, biaxally oriented nylon, or combinations of two or more thereof.
1 more element
Dependencies are inferred from the claim text.