Process for producing a multifunctional dielectric layer on a substrate
OwnerJohann Helneder, Markus Schwerd +4inventors
InventorsJohann Helneder, Markus Schwerd, Thomas Goebel, Andrea Mitchell, Heinrich Koerner, Martina Hommel
Life of this patent
Estimating the term…
Abstract
A multifunctional dielectric layer can be formed on a substrate, especially on an exposed metallic strip conductor system on a substrate. An additional metal layer is formed across the surface of the exposed metal strip conductors. The metal layer is then at least partially converted to a nonconducting metal oxide, the dielectric layer.
Claims18
A process for producing a multifunctional dielectric layer on a substrate, the process comprising:
- forming a plurality of metal interconnects that are embedded in an insulator and have been provided with a diffusion barrier at the side walls;
- applying a further metal layer to uncovered portions of the metal interconnects as a metallic covering, the further metal layer comprising a metal, a metal nitride or a layer sequence of these materials;
- and
- converting the further metal layer into a nonconducting metal oxide thereby forming a dielectric layer.
A process for producing a multifunctional dielectric layer on an uncovered metallic interconnect system on a substrate, the interconnect system including metal interconnects that have been embedded in an insulator on a substrate and have been provided with a diffusion barrier at side walls, the method comprising:
- performing a chemical mechanical polishing process to expose an upper surface of the metal interconnects;
- applying a further metal layer, formed from a metal, a metal nitride or a layer sequence of these materials, to the uncovered metal interconnects as a metallic covering layer following the chemical mechanical polishing process;
- and
- converting portions of the further metal layer into a nonconducting metal oxide thereby forming a dielectric layer as a barrier layer on some interconnects and as a capacitor dielectric on other interconnects, wherein portions of the further metal layer, which have been covered, are not converted and form resistors.
Dependencies are inferred from the claim text.