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US 2006/0222313 A1Published application
Optical modulator module package structure
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorSuk Hong
Life of this patent
Estimating the term…
Abstract
Disclosed herein is an optical modulator module package structure. In the optical modulator module package structure, an optical modulator device and a drive integrated circuit device are flip-chip bonded to a substrate, and an opening of the substrate is blocked using a piece of glass.
Claims7
An optical modulator module package structure, comprising:
- an optical modulator device, in which an active portion reflects or diffracts incident light depending on an input external control signal;
- a drive integrated circuit device controlling the active portion of the optical modulator device depending on the external control signal;
- a substrate having an opening to pass incident light therethrough, to an upper side of which the optical modulator device is attached so that the active portion corresponds in position to the opening and which has an internal circuit so that the external control signal is transported to the drive integrated circuit device therethrough and a control signal of the drive integrated circuit device is transported to the optical modulator device therethrough, the drive integrated circuit device being formed around the optical modulator device;
- and
- a light transmissive cover which is made of a light transmissive material to cover the opening of the substrate.
2 more elements
Dependencies are inferred from the claim text.