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US 2006/0222284 A1Published application
Optical sub-assembly
AssigneeIntel Corporation
InventorEdris Mohammed
Life of this patent
Estimating the term…
Abstract
A system is disclosed. The system includes a printed circuit board (PCB), a substrate mounted on the PCB, an integrated circuit (IC) mounted on the substrate, an optoelectronic sub-assembly mounted on the substrate and coupled to the IC; and a waveguide patterned on the substrate.
Claims20
A system comprising:
- a printed circuit board (PCB);
- a substrate mounted on the PCB;
- an integrated circuit (IC) mounted on the substrate;
- an optoelectronic sub-assembly mounted on the substrate and coupled to the IC, including a flexible interconnect coupled to the IC having a first end parallel to the substrate and a second end non-parallel to the substrate;
- and
- a waveguide patterned on the substrate, wherein the optoelectronic sub-assembly turns electrons up to establish direct alignment between an optic axis of the optoelectronic IC and the waveguide.
3 more elements
(canceled)
An optoelectronic sub-assembly comprising:
- a flexible printed circuit board (PCB) coupled to an integrated circuit (IC);
- a substrate mounted on the flexible PCB, wherein the flexible PCB has a first end parallel to the substrate and a second end non-parallel to the substrate;
- and
- an optoelectronic IC, mounted on the substrate, the optoelectronic sub-assembly to establish direct alignment between an optic axis of the optoelectronic IC and a waveguide.
1 more element
A method comprising:
- patterning a waveguide on a substrate;
- mounting an integrated circuit (IC) on the substrate;
- and
- mounting an optoelectronic sub-assembly on the substrate to establish direct alignment between an optic axis of the optoelectronic IC and the waveguide by coupling a first end of a flexible printed circuit board (PCB) to the IC parallel to the substrate.
1 more element
Dependencies are inferred from the claim text.