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US 2006/0221587 A1Published application
Multi-wire board, its manufacturing method, and electronic apparatus having the multi-wire board
AssigneeFujitsu Limited
InventorYoshihiro Morita
Life of this patent
Estimating the term…
Abstract
A multi-wire board includes first and second substrates, and plural wires that connect the first and second substrates to each other, and expose to the outside, wherein the wires form a predetermined pattern in the first substrate.
Claims5
-5. (canceled)
An electronic apparatus comprising:
- a multi-wire board that includes first and second substrates, and plural wires that connect said first and second substrates to each other, and expose to the outside;
- a first connector fixed onto the second substrate;
- a second connector connectible to said first connector;
- and
- a third substrate, onto which said second connector is fixed.
2 more elements
-10. (canceled)
Dependencies are inferred from the claim text.