Interposable heat sink for adjacent memory modules

A device for dissipating heat generated by electronic components on opposed surfaces of a pair of adjacent memory modules supported in substantially parallel positions on adjacent connectors of a printed circuit board, the device comprising:

• a thermally conductive first member having a respective first surface configured to thermally couple with electronic components of a first of the pair of adjacent memory modules;
• a thermally conductive second member having a respective first surface configured to thermally couple with electronic components of a second of the pair of adjacent memory modules;
• said first and second members being spaced to permit insertion between said adjacent memory modules;
• and
• a wedge member selectively positionable between said first and second members to urge said first and second members away from one another and into abutting relationship with respective electronic components of said opposed surfaces of said adjacent memory modules.

An information processing system comprising:

• a printed circuit board supporting a pair of connectors in substantially parallel positions adjacent one another, each of said connectors being capable of receiving a respective memory module;
• a pair of memory modules, each of said plurality of memory modules being mounted in a respective one of said pair of connectors, one of said plurality of memory modules supporting electronic components on a first side thereof, another of said plurality of memory modules supporting electronic components on a second side thereof, said first side facing said second side;
• a device for dissipating heat generated by said electronic components, said device comprising:
• a thermally conductive first member abutting said electronic components of said first side in thermal coupling therewith;
• and
• a thermally conductive second member abutting said electronic components of said second side in thermal coupling therewith.