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US 2006/0221573 A1Published application
Heat sink for multiple semiconductor modules
OwnerMing Liinventor
Life of this patent
Estimating the term…
Abstract
A system for dissipating heat away from multiple semiconductor modules includes a thermal conductor having a thermally conductive base and multiple thermally conductive semiconductor module connectors thermally coupled to the base. Each of the semiconductor module connectors is configured to connect to a different semiconductor module of multiple semiconductor modules.
Claims24
A system for dissipating heat, comprising:
- a thermal conductor comprising:
- a thermally conductive base;
- and
- multiple thermally conductive semiconductor module connectors thermally coupled to said base, where each of said semiconductor module connectors is configured to connect to a different semiconductor module of multiple semiconductor modules.
1 more element
A system for dissipating heat, comprising:
- multiple semiconductor modules;
- and
- a thermal conductor comprising:
- a thermally conductive base;
- and
- multiple thermally conductive semiconductor module connectors thermally coupled to said base, where each of said semiconductor module connectors is configured to mechanically and thermally couple to a respective semiconductor module of said multiple semiconductor modules.
3 more elements
A system for dissipating heat comprising:
- multiple semiconductor modules;
- a means for conducting heat away from said semiconductor modules;
- and
- multiple means for connecting said semiconductor modules to said means for conducting heat away from said semiconductor modules, where each of said means for connecting is configured to mechanically and thermally couple to a respective semiconductor module of said multiple semiconductor modules.
1 more element
Dependencies are inferred from the claim text.