Slider, magnetic head assembly and manufacturing the same

A method of manufacturing a slider, the slider including electrode pads each of which is bonded to an electrode pad of a flexible printed circuit board using a solder ball, the method comprising:

• performing surface cleaning on the electrode pad of the slider in a vacuum atmosphere;
• forming an Au surface protective film on a new film surface of the electrode pad exposed by the surface cleaning, in the same vacuum atmosphere;
• and
• covering the entire surface of the electrode pad of the slider with the Au surface protective film.

A method of manufacturing a slider, the slider including electrode pads each of which is bonded to an electrode pad of a flexible printed circuit board using a solder ball, the method comprising:

• performing surface cleaning on the electrode pad of the slider in a vacuum atmosphere;
• and
• forming an adhesive layer, made of Ni, NiFe or NiCu, on a new film surface of the electrode pad exposed by the surface cleaning, in the same vacuum atmosphere, and
• forming an Au surface protective film on the adhesive layer so as to cover the entire surface of the electrode pad of the slider with the adhesive layer and the Au surface protective film.