Coined features including material flow openings
AssigneeSeagate Technology LLC
InventorsWaiOnn Chee, BoonSeng Ong
Life of this patent
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Abstract
A housing or cover having a coined region or regions to provide additional clearance or height within form factor dimensions of the housing or cover. In embodiments described, the housing or cover includes coined regions which have a smaller body thickness dimension than a stock thickness of the housing or cover to provide additional clearance. The coined regions include openings, slots or holes to provide a collection site for material removed from the coined regions to form the smaller body thickness dimension.
Claims20
A cover for a data storage device comprising:
- a cover body having a stock body thickness between opposed surfaces;
- and
- a coined region on a portion of the cover body having a coined body thickness smaller than the stocked body thickness and the coined region including at least one opening between the opposed surfaces of the cover body.
A fabrication method comprising the steps of:
- stamping a stock material to form a housing body having body perimeter and a stock body thickness;
- cutting at least one opening or hole in a region of the housing body;
- and
- coining a smaller body thickness in the region of the housing body having the at least one opening or hole.
A housing comprising:
- a housing body including a body perimeter and stocked body thickness;
- and
- at least one coined region in the housing body having a coined thickness dimension smaller than the stock body thickness and the coined region having at least one flow opening or a plurality of flow openings.
Dependencies are inferred from the claim text.