Methods for bonding radiation curable compositions to a substrate

A method for improving adhesion of a radiation curable layer to a semiconductor chip, comprising:

• applying a silane adhesion promoter to a surface of the semiconductor chip, wherein the surface comprises resistive and conductive layers;
• drying the silane adhesion promoter on the surface of the semiconductor chip without crosslinking the silane adhesion promoter;
• applying a radiation curable layer on top of the silane adhesion promoter on the surface of the semiconductor chip;
• and
• baking the semiconductor chip with the radiation curable layer and the silane adhesion promoter layer on the surface of the semiconductor chip.

A method for making an ink jet pen for an ink jet printer comprising:

• applying a silane adhesion promoter to a surface of the semiconductor chip, wherein the surface comprises resistive and conductive layers;
• drying the silane adhesion promoter on the surface of the semiconductor chip without crosslinking the silane adhesion promoter;
• applying a radiation curable layer on top of the silane adhesion promoter on the surface of the semiconductor chip;
• curing the radiation curable layer by exposure to actinic radiation in a pattern to thereby form a cured region of the radiation curable layer;
• removing any uncured regions from the radiation curable layer;
• baking the semiconductor chip to crosslink the cured resin layer;
• aligning and attaching a nozzle plate to the semiconductor chip with an adhesive to provide a nozzle plate/chip assembly;
• and
• attaching a flexible circuit to the nozzle plate/chip assembly.

An ink jet printer, comprising:

• a printer frame;
• a print head having ink passageways for ejecting ink, wherein the print head is formed by:
• applying a silane adhesion promoter to a surface of a silicon substrate, wherein the silicon substrate comprises resistive and conductive layers;
• drying the silane adhesion promoter on the surface of the silicon substrate without crosslinking the silane adhesion promoter;
• applying a radiation curable layer on top of the silane adhesion promoter on the surface of the silicon substrate;
• curing the radiation curable layer by exposure to actinic radiation in a pattern to thereby form a cured region of the radiation curable layer;
• removing any uncured regions from the radiation curable layer;
• baking the silicon substrate to crosslink the cured resin layer;
• aligning and attaching the nozzle plate to the silicon substrate with an adhesive to provide a nozzle plate/chip assembly;
• and
• attaching a flexible circuit to the nozzle plate/chip assembly;
• and
• a print head carrier assembly including a carriage for carrying a print head, the print head carrier assembly being mounted to the printer frame effecting a reciprocating movement of the print head through a printing zone during a printing operation.

An ink jet print head having ink passage ways, wherein the print head is formed by:

• applying a silane adhesion promoter to a surface of a silicon substrate, wherein the silicon substrate comprises resistive and conductive layers;
• drying the silane adhesion promoter on the surface of the silicon substrate without crosslinking the silane adhesion promoter;
• applying a radiation curable layer on top of the silane adhesion promoter on the surface of the silicon substrate;
• curing the radiation curable layer by exposure to actinic radiation in a pattern to thereby form a cured region of the radiation curable layer;
• removing any uncured regions from the radiation curable layer;
• baking the silicon substrate to crosslink the cured resin layer;
• aligning and attaching the nozzle plate to the silicon substrate with an adhesive to provide a nozzle plate/chip assembly;
• and
• attaching a flexible circuit to the nozzle plate/chip assembly.